WEKO3
アイテム
{"_buckets": {"deposit": "ca46a0e3-1b6e-4184-b597-8e9d8b6f0dee"}, "_deposit": {"created_by": 3, "id": "845", "owners": [3], "pid": {"revision_id": 0, "type": "depid", "value": "845"}, "status": "published"}, "_oai": {"id": "oai:kyutech.repo.nii.ac.jp:00000845", "sets": ["24"]}, "author_link": ["17054", "3797", "3794", "471"], "control_number": "845", "item_1689815586683": {"attribute_name": "CRID", "attribute_value_mlt": [{"subitem_relation_type": "isIdenticalTo", "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://cir.nii.ac.jp/crid/1390001206263280768", "subitem_relation_type_select": "URI"}}]}, "item_21_biblio_info_6": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2007-09-25", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "733", "bibliographicPageEnd": "1812", "bibliographicPageStart": "1806", "bibliographicVolumeNumber": "73", "bibliographic_titles": [{"bibliographic_title": "日本機械学會論文集. B編", "bibliographic_titleLang": "ja"}, {"bibliographic_title": "Transactions of the Japan Society of Mechanical Engineers. B", "bibliographic_titleLang": "en"}]}]}, "item_21_description_4": {"attribute_name": "抄録", "attribute_value_mlt": [{"subitem_description": "In recent years, CMP (Chemical and Mechanical Polishing) greatly has taken its role as technology of planarizations to produce multi-level inter-connections. While slurry is flowing on a polishing pad in CMP, the polishing pad is in contact with the wafer to polish the wafer surface. Grooves are expected to supply slurry evenly, and to remove wasted particles. Our study aims at developing the design of the best patterns of grooves. By predicting slurry flows between wafers and polishing pads in CMP using CFD, the influence of the slurry flow by the grooved pad can be analyzed. In this paper simulations were carried out for cases without groove, with circular grooves and radial grooves. With analysis of the flow field, how grooves affect the velocity distributions are studied. We also simulated the replacement of old slurry to new slurry, and the roles of the grooves are discussed.", "subitem_description_language": "en", "subitem_description_type": "Abstract"}]}, "item_21_publisher_7": {"attribute_name": "出版社", "attribute_value_mlt": [{"subitem_publisher": "日本機械学会", "subitem_publisher_language": "ja"}]}, "item_21_relation_12": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_type": "isIdenticalTo", "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://doi.org/10.1299/kikaib.73.1806", "subitem_relation_type_select": "DOI"}}]}, "item_21_select_59": {"attribute_name": "査読の有無", "attribute_value_mlt": [{"subitem_select_item": "yes"}]}, "item_21_source_id_10": {"attribute_name": "NCID", "attribute_value_mlt": [{"subitem_source_identifier": "AN00187441", "subitem_source_identifier_type": "NCID"}]}, "item_21_source_id_8": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "1884-8346", "subitem_source_identifier_type": "EISSN"}, {"subitem_source_identifier": "0387-5016", "subitem_source_identifier_type": "PISSN"}]}, "item_21_text_64": {"attribute_name": "業績ID", "attribute_value_mlt": [{"subitem_text_value": "123E7C2941545E6F4925755500056206"}]}, "item_21_version_type_58": {"attribute_name": "出版タイプ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorAffiliations": [{"affiliationNames": [{"affiliationNameLang": "ja"}]}], "creatorNames": [{"creatorName": "Nagayama, Katsuya", "creatorNameLang": "en"}, {"creatorName": "永山, 勝也", "creatorNameLang": "ja"}, {"creatorName": "ナガヤマ, カツヤ", "creatorNameLang": "ja-Kana"}], "familyNames": [{"familyName": "Nagayama", "familyNameLang": "en"}, {"familyName": "永山", "familyNameLang": "ja"}, {"familyName": "ナガヤマ", "familyNameLang": "ja-Kana"}], "givenNames": [{"givenName": "Katsuya", "givenNameLang": "en"}, {"givenName": "勝也", "givenNameLang": "ja"}, {"givenName": "カツヤ", "givenNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "17054", "nameIdentifierScheme": "WEKO"}, {"nameIdentifier": "70363398", "nameIdentifierScheme": "e-Rad", "nameIdentifierURI": "https://nrid.nii.ac.jp/ja/nrid/1000070363398"}, {"nameIdentifier": "28167627900", "nameIdentifierScheme": "Scopus著者ID", "nameIdentifierURI": "https://www.scopus.com/authid/detail.uri?authorId=28167627900"}, {"nameIdentifier": "256", "nameIdentifierScheme": "九工大研究者情報", "nameIdentifierURI": "https://hyokadb02.jimu.kyutech.ac.jp/html/256_ja.html"}]}, {"creatorAffiliations": [{"affiliationNames": [{"affiliationNameLang": "ja"}]}], "creatorNames": [{"creatorName": "Kimura, Keiichi", "creatorNameLang": "en"}, {"creatorName": "木村, 景一", "creatorNameLang": "ja"}, {"creatorName": "キムラ, ケンイチ", "creatorNameLang": "ja-Kana"}], "familyNames": [{"familyName": "Kimura", "familyNameLang": "en"}, {"familyName": "木村", "familyNameLang": "ja"}, {"familyName": "キムラ", "familyNameLang": "ja-Kana"}], "givenNames": [{"givenName": "Keiichi", "givenNameLang": "en"}, {"givenName": "景一", "givenNameLang": "ja"}, {"givenName": "ケンイチ", "givenNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "3797", "nameIdentifierScheme": "WEKO"}, {"nameIdentifier": "56421011300", "nameIdentifierScheme": "Scopus著者ID", "nameIdentifierURI": "https://www.scopus.com/authid/detail.uri?authorId=56421011300"}]}, {"creatorNames": [{"creatorName": "森下, 浩文", "creatorNameLang": "ja"}, {"creatorName": "Morishita, Hirofumi", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "3794", "nameIdentifierScheme": "WEKO"}]}, {"creatorAffiliations": [{"affiliationNames": [{"affiliationNameLang": "ja"}]}], "creatorNames": [{"creatorName": "Tanaka, Kazuhiro", "creatorNameLang": "en"}, {"creatorName": "田中, 和博", "creatorNameLang": "ja"}, {"creatorName": "タナカ, カズヒロ", "creatorNameLang": "ja-Kana"}], "familyNames": [{"familyName": "Tanaka", "familyNameLang": "en"}, {"familyName": "田中", "familyNameLang": "ja"}, {"familyName": "タナカ", "familyNameLang": "ja-Kana"}], "givenNames": [{"givenName": "Kazuhiro", "givenNameLang": "en"}, {"givenName": "和博", "givenNameLang": "ja"}, {"givenName": "カズヒロ", "givenNameLang": "ja-Kana"}], "nameIdentifiers": [{"nameIdentifier": "471", "nameIdentifierScheme": "WEKO"}, {"nameIdentifier": "80171742", "nameIdentifierScheme": "e-Rad", "nameIdentifierURI": "https://nrid.nii.ac.jp/ja/nrid/1000080171742"}, {"nameIdentifier": "55624483319", "nameIdentifierScheme": "Scopus著者ID", "nameIdentifierURI": "https://www.scopus.com/authid/detail.uri?authorId=55624483319"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2009-02-06"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "110006402869.pdf", "filesize": [{"value": "1.1 MB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 1100000.0, "url": {"label": "110006402869.pdf", "url": "https://kyutech.repo.nii.ac.jp/record/845/files/110006402869.pdf"}, "version_id": "77c6ae5e-d596-45da-91aa-a0fce417d3d0"}]}, "item_keyword": {"attribute_name": "キーワード", "attribute_value_mlt": [{"subitem_subject": "Polishing", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Computational Fluid Dynamics", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Shear Flow", "subitem_subject_scheme": "Other"}, {"subitem_subject": "Micro Channel", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "jpn"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "CMPにおけるウエハとパッドすきま内スラリー流れの数値解析 : 溝なし,同心円溝,放射状溝での比較(流体工学,流体機械)", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "CMPにおけるウエハとパッドすきま内スラリー流れの数値解析 : 溝なし,同心円溝,放射状溝での比較(流体工学,流体機械)", "subitem_title_language": "ja"}, {"subitem_title": "A Computational Study on Slurry Flow Between a Wafer and Pad in CMP: Cases without Groove, with Circular Grooves and Radial Grooves (Fluid Engineering)", "subitem_title_language": "en"}]}, "item_type_id": "21", "owner": "3", "path": ["24"], "permalink_uri": "http://hdl.handle.net/10228/1263", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2009-02-06"}, "publish_date": "2009-02-06", "publish_status": "0", "recid": "845", "relation": {}, "relation_version_is_last": true, "title": ["CMPにおけるウエハとパッドすきま内スラリー流れの数値解析 : 溝なし,同心円溝,放射状溝での比較(流体工学,流体機械)"], "weko_shared_id": -1}
CMPにおけるウエハとパッドすきま内スラリー流れの数値解析 : 溝なし,同心円溝,放射状溝での比較(流体工学,流体機械)
http://hdl.handle.net/10228/1263
http://hdl.handle.net/10228/1263037d4278-ece1-4188-873c-104eebe3bcbe
名前 / ファイル | ライセンス | アクション |
---|---|---|
110006402869.pdf (1.1 MB)
|
|
Item type | 学術雑誌論文 = Journal Article(1) | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
公開日 | 2009-02-06 | |||||||||||
資源タイプ | ||||||||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||||||||
資源タイプ | journal article | |||||||||||
タイトル | ||||||||||||
言語 | ja | |||||||||||
タイトル | CMPにおけるウエハとパッドすきま内スラリー流れの数値解析 : 溝なし,同心円溝,放射状溝での比較(流体工学,流体機械) | |||||||||||
タイトル | ||||||||||||
言語 | en | |||||||||||
タイトル | A Computational Study on Slurry Flow Between a Wafer and Pad in CMP: Cases without Groove, with Circular Grooves and Radial Grooves (Fluid Engineering) | |||||||||||
言語 | ||||||||||||
言語 | jpn | |||||||||||
著者 |
永山, 勝也
× 永山, 勝也
WEKO
17054
× 木村, 景一× 森下, 浩文× 田中, 和博 |
|||||||||||
抄録 | ||||||||||||
内容記述タイプ | Abstract | |||||||||||
内容記述 | In recent years, CMP (Chemical and Mechanical Polishing) greatly has taken its role as technology of planarizations to produce multi-level inter-connections. While slurry is flowing on a polishing pad in CMP, the polishing pad is in contact with the wafer to polish the wafer surface. Grooves are expected to supply slurry evenly, and to remove wasted particles. Our study aims at developing the design of the best patterns of grooves. By predicting slurry flows between wafers and polishing pads in CMP using CFD, the influence of the slurry flow by the grooved pad can be analyzed. In this paper simulations were carried out for cases without groove, with circular grooves and radial grooves. With analysis of the flow field, how grooves affect the velocity distributions are studied. We also simulated the replacement of old slurry to new slurry, and the roles of the grooves are discussed. | |||||||||||
言語 | en | |||||||||||
書誌情報 |
ja : 日本機械学會論文集. B編 en : Transactions of the Japan Society of Mechanical Engineers. B 巻 73, 号 733, p. 1806-1812, 発行日 2007-09-25 |
|||||||||||
出版社 | ||||||||||||
言語 | ja | |||||||||||
出版者 | 日本機械学会 | |||||||||||
DOI | ||||||||||||
関連タイプ | isIdenticalTo | |||||||||||
識別子タイプ | DOI | |||||||||||
関連識別子 | https://doi.org/10.1299/kikaib.73.1806 | |||||||||||
CRID | ||||||||||||
関連タイプ | isIdenticalTo | |||||||||||
識別子タイプ | URI | |||||||||||
関連識別子 | https://cir.nii.ac.jp/crid/1390001206263280768 | |||||||||||
NCID | ||||||||||||
収録物識別子タイプ | NCID | |||||||||||
収録物識別子 | AN00187441 | |||||||||||
ISSN | ||||||||||||
収録物識別子タイプ | EISSN | |||||||||||
収録物識別子 | 1884-8346 | |||||||||||
ISSN | ||||||||||||
収録物識別子タイプ | PISSN | |||||||||||
収録物識別子 | 0387-5016 | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | Polishing | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | Computational Fluid Dynamics | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | Shear Flow | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | Micro Channel | |||||||||||
出版タイプ | ||||||||||||
出版タイプ | VoR | |||||||||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||||||||
査読の有無 | ||||||||||||
値 | yes | |||||||||||
業績ID | ||||||||||||
123E7C2941545E6F4925755500056206 |