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Improved DICM with an IR camera for Imaging of Strain and Temperature in Cross Section of TO packages
http://hdl.handle.net/10228/00008397
http://hdl.handle.net/10228/0000839765565893-ccf2-4f85-94b2-54ac964bcc33
名前 / ファイル | ライセンス | アクション |
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nperc179.pdf (833.3 kB)
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Item type | 学術雑誌論文 = Journal Article(1) | |||||||||||||||||
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公開日 | 2021-07-02 | |||||||||||||||||
資源タイプ | ||||||||||||||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||||||||||||||
資源タイプ | journal article | |||||||||||||||||
タイトル | ||||||||||||||||||
タイトル | Improved DICM with an IR camera for Imaging of Strain and Temperature in Cross Section of TO packages | |||||||||||||||||
言語 | ||||||||||||||||||
言語 | eng | |||||||||||||||||
著者 |
Masuda, Yoshiki
× Masuda, Yoshiki× 渡邉, 晃彦
WEKO
16333
× 大村, 一郎
WEKO
16176
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抄録 | ||||||||||||||||||
内容記述タイプ | Abstract | |||||||||||||||||
内容記述 | Digital image correlation method (DICM) is effective for failure mechanism investigation of power semiconductor packages by obtaining the mechanical strain in the package. In DICM, the displacement and strain are calculated by the images of a random pattern on the surface of the object captured by a camera. We have developed a new DICM system to obtain the mechanical strain and the temperature distributions simultaneously using an infrared camera (IR-DICM). In previous IR-DICMs, the strain observation was limited to high temperatures under constant condition, so that stress location and phase in the power cycle cannot be identified for failure mechanism investigation. In this paper, We successfully demonstrated the IR-DICM on TO-3P package power cycling test and obtained strain and temperature distributions throughout the power cycle using new sample preparation and special image processing algorithm. | |||||||||||||||||
備考 | ||||||||||||||||||
内容記述タイプ | Other | |||||||||||||||||
内容記述 | 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD 2021), 30th of May and 3rd of June, 2021, Full Virtual Conference | |||||||||||||||||
書誌情報 |
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) p. 167-170, 発行日 2021-06-15 |
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出版者 | IEEE | |||||||||||||||||
DOI | ||||||||||||||||||
関連タイプ | isVersionOf | |||||||||||||||||
識別子タイプ | DOI | |||||||||||||||||
関連識別子 | https://doi.org/10.23919/ISPSD50666.2021.9452304 | |||||||||||||||||
ISBN | ||||||||||||||||||
識別子タイプ | ISBN | |||||||||||||||||
関連識別子 | 978-4-88686-422-2 | |||||||||||||||||
ISBN | ||||||||||||||||||
識別子タイプ | ISBN | |||||||||||||||||
関連識別子 | 978-1-7281-8985-7 | |||||||||||||||||
日本十進分類法 | ||||||||||||||||||
主題Scheme | NDC | |||||||||||||||||
主題 | 549 | |||||||||||||||||
ISSN | ||||||||||||||||||
収録物識別子タイプ | ISSN | |||||||||||||||||
収録物識別子 | 1946-0201 | |||||||||||||||||
ISSN | ||||||||||||||||||
収録物識別子タイプ | ISSN | |||||||||||||||||
収録物識別子 | 1063-6854 | |||||||||||||||||
著作権関連情報 | ||||||||||||||||||
権利情報 | Copyright (c) 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Digital Image Correlation | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Infrared camera | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Strain distribution imaging | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Temperature distribution imaging | |||||||||||||||||
出版タイプ | ||||||||||||||||||
出版タイプ | AM | |||||||||||||||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||||||||
査読の有無 | ||||||||||||||||||
値 | yes | |||||||||||||||||
連携ID | ||||||||||||||||||
9002 | ||||||||||||||||||
資料タイプ | ||||||||||||||||||
内容記述タイプ | Other | |||||||||||||||||
内容記述 | Journal Article | |||||||||||||||||
著者所属 | ||||||||||||||||||
Kyushu Institute of Technology | ||||||||||||||||||
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Kyushu Institute of Technology | ||||||||||||||||||
著者所属 | ||||||||||||||||||
Kyushu Institute of Technology |