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Real-time imaging of temperature distribution inside a power device under a power cycling test
http://hdl.handle.net/10228/00007289
http://hdl.handle.net/10228/0000728982165ca8-9931-4c79-94ac-a3548faebf57
名前 / ファイル | ライセンス | アクション |
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nperc93.pdf (1.7 MB)
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Item type | 学術雑誌論文 = Journal Article(1) | |||||||||||||||||
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公開日 | 2019-07-11 | |||||||||||||||||
資源タイプ | ||||||||||||||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||||||||||||||
資源タイプ | journal article | |||||||||||||||||
タイトル | ||||||||||||||||||
タイトル | Real-time imaging of temperature distribution inside a power device under a power cycling test | |||||||||||||||||
言語 | ||||||||||||||||||
言語 | eng | |||||||||||||||||
著者 |
渡邉, 晃彦
× 渡邉, 晃彦
WEKO
16333
× Nagao, R.× 大村, 一郎
WEKO
16176
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抄録 | ||||||||||||||||||
内容記述タイプ | Abstract | |||||||||||||||||
内容記述 | The analysis of temperature distribution in a power device package is essential to increase the reliability of power devices, because the temperature swing during the operation creates mechanical stress at the interfaces between these materials. However, the temperature distribution is difficult to obtain under operating conditions because of the limitation in the use of non-destructive methods to measure the inside temperature of the device. In this paper, we propose a method of real-time imaging of temperature distribution inside a DUT. This method is based on a “real-time simulation”. The real-time simulation was realized by combining surface temperature monitoring and high-speed thermal simulation. The thermal simulator calculates temperature distribution inside the package by using the monitored surface temperature as a parameter. We demonstrate our system with a TO-220 package device under a power cycling test. The system indicated a temperature distribution change in the package with a frame rate of less than 1 s and the temperature difference at the Si chip was within 2 °C by a comparison with that estimated from forward voltage drop. | |||||||||||||||||
書誌情報 |
Microelectronics Reliability 巻 76-77, p. 490-494, 発行日 2017-07-11 |
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出版社 | ||||||||||||||||||
出版者 | Elsevier | |||||||||||||||||
DOI | ||||||||||||||||||
関連タイプ | isVersionOf | |||||||||||||||||
識別子タイプ | DOI | |||||||||||||||||
関連識別子 | info:doi/10.1016/j.microrel.2017.06.092 | |||||||||||||||||
ISSN | ||||||||||||||||||
収録物識別子タイプ | ISSN | |||||||||||||||||
収録物識別子 | 0026-2714 | |||||||||||||||||
著作権関連情報 | ||||||||||||||||||
権利情報 | Elsevier | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Power device | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Temperature distribution | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Real-time simulation | |||||||||||||||||
キーワード | ||||||||||||||||||
主題Scheme | Other | |||||||||||||||||
主題 | Power cycling test | |||||||||||||||||
出版タイプ | ||||||||||||||||||
出版タイプ | AM | |||||||||||||||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||||||||
査読の有無 | ||||||||||||||||||
値 | yes | |||||||||||||||||
連携ID | ||||||||||||||||||
6486 | ||||||||||||||||||
資料タイプ | ||||||||||||||||||
内容記述タイプ | Other | |||||||||||||||||
内容記述 | Journal Article | |||||||||||||||||
著者所属 | ||||||||||||||||||
Department of Electrical Engineering/Electronics, Kyushu Institute of Technology | ||||||||||||||||||
著者所属 | ||||||||||||||||||
Department of Electrical Engineering/Electronics, Kyushu Institute of Technology | ||||||||||||||||||
著者所属 | ||||||||||||||||||
Department of Electrical Engineering/Electronics, Kyushu Institute of Technology | ||||||||||||||||||
情報源 | ||||||||||||||||||
識別子タイプ | DOI | |||||||||||||||||
関連識別子 | https://doi.org/10.1016/j.microrel.2017.06.092 |