| アイテムタイプ |
学術雑誌論文 = Journal Article(1) |
| 公開日 |
2024-06-11 |
| 資源タイプ |
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資源タイプ識別子 |
http://purl.org/coar/resource_type/c_6501 |
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資源タイプ |
journal article |
| タイトル |
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タイトル |
Laminated wafer with conductive diamond layer formed by surface-activated bonding at room temperature for micro-electro mechanical system sensors |
|
言語 |
en |
| 言語 |
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言語 |
eng |
| 著者 |
Koga, Yoshihiro
山田, 駿介
Tanaka, Shuji
Kurita, Kazunari
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| 抄録 |
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内容記述タイプ |
Abstract |
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内容記述 |
We propose the use of a laminated wafer with a conductive diamond layer for forming cavities as an alternative silicon-on-insulator wafer for micro-electro mechanical system (MEMS) sensors. Since this wafer has no insulator such as a buried oxide (BOX) layer but a conductive layer, it is not charged during plasma treatment in MEMS sensor fabrication processes. The conductive diamond layer was formed on a base wafer doped with boron of more than 2 × 1021 atoms cm−3 by microwave-plasma-enhanced chemical vapor deposition. The resistivity of this layer was 0.025 Ω cm, and this layer can be selectively etched to a base wafer made of silicon crystal, such as a BOX layer. In addition, a silicon wafer can be bonded to its layer without voids with gaps of more than 2 nm by surface-activated bonding. Therefore, we believe that the laminated wafer studied here is useful for the fabrication processes for MEMS sensors that may otherwise be damaged by plasma treatment. |
|
言語 |
en |
| 書誌情報 |
en : Japanese Journal of Applied Physics
巻 61,
号 SF,
p. SF1007,
発行日 2022-04-20
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| 出版社 |
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出版者 |
応用物理学会 |
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言語 |
ja |
| DOI |
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関連タイプ |
isIdenticalTo |
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識別子タイプ |
DOI |
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関連識別子 |
https://doi.org/10.35848/1347-4065/ac6056 |
| NCID |
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収録物識別子タイプ |
NCID |
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収録物識別子 |
AA12295836 |
| ISSN |
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収録物識別子タイプ |
PISSN |
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収録物識別子 |
0021-4922 |
| ISSN |
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収録物識別子タイプ |
EISSN |
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収録物識別子 |
1347-4065 |
| 著作権関連情報 |
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権利情報Resource |
https://creativecommons.org/licenses/by/4.0/ |
|
権利情報 |
Copyright (c) 2022 The Author(s). Published on behalf of The Japan Society of Applied Physics by IOP Publishing Ltd. Content from this work may be used under the terms of the Creative Commons Attribution 4.0 license. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. |
| 出版タイプ |
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出版タイプ |
VoR |
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出版タイプResource |
http://purl.org/coar/version/c_970fb48d4fbd8a85 |
| 査読の有無 |
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値 |
yes |
| 研究者情報 |
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URL |
https://hyokadb02.jimu.kyutech.ac.jp/html/100001774_ja.html |
| 論文ID（連携） |
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値 |
10430578 |
| 連携ID |
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値 |
12280 |
10430578.pdf (2 MB)
