{"created":"2023-05-15T11:57:50.372393+00:00","id":3617,"links":{},"metadata":{"_buckets":{"deposit":"8bec1ac4-c1c6-4b13-b1ce-a6692e124415"},"_deposit":{"created_by":18,"id":"3617","owners":[18],"pid":{"revision_id":0,"type":"depid","value":"3617"},"status":"published"},"_oai":{"id":"oai:kyutech.repo.nii.ac.jp:00003617","sets":["6:7"]},"author_link":[],"item_20_date_granted_61":{"attribute_name":"学位授与年月日","attribute_value_mlt":[{"subitem_dategranted":"2010-03-24"}]},"item_20_degree_grantor_59":{"attribute_name":"学位授与機関","attribute_value_mlt":[{"subitem_degreegrantor":[{"subitem_degreegrantor_name":"九州工業大学"}],"subitem_degreegrantor_identifier":[{"subitem_degreegrantor_identifier_name":"17104","subitem_degreegrantor_identifier_scheme":"kakenhi"}]}]},"item_20_degree_name_58":{"attribute_name":"学位名","attribute_value_mlt":[{"subitem_degreename":"博士（情報工学）"}]},"item_20_description_30":{"attribute_name":"目次","attribute_value_mlt":[{"subitem_description":"第１章 緒論||第２章 平坦化CMP技術||第３章 スラリー流れの可視化による材料除去メカニズムの考察||第４章 原子間力顕微鏡を用いたスラリー中の粒子分布状態の考察||第５章 CMPプロセスにおける材料除去メカニズムの理論的考察||第６章 化学反応層の性質と研磨粒子の機能||第7章 研磨実験による凝着現象の確認||第８章 結論","subitem_description_type":"TableOfContents"}]},"item_20_description_5":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_description":"九州工業大学博士学位論文 学位記番号:情工博甲第240号 学位授与年月日:平成22年3月24日","subitem_description_type":"Other"}]},"item_20_description_60":{"attribute_name":"学位授与年度","attribute_value_mlt":[{"subitem_description":"平成21年度","subitem_description_type":"Other"}]},"item_20_dissertation_number_62":{"attribute_name":"学位授与番号","attribute_value_mlt":[{"subitem_dissertationnumber":"甲第240号"}]},"item_20_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.18997/00003611","subitem_identifier_reg_type":"JaLC"}]},"item_20_text_34":{"attribute_name":"アドバイザー","attribute_value_mlt":[{"subitem_text_value":"木村, 景一"}]},"item_20_version_type_63":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"橋山, 雄一","creatorNameLang":"ja"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2010-12-27"}],"displaytype":"detail","filename":"jou_k_240.pdf","filesize":[{"value":"3.9 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"jou_k_240.pdf","objectType":"fulltext","url":"https://kyutech.repo.nii.ac.jp/record/3617/files/jou_k_240.pdf"},"version_id":"8a43901c-33aa-4120-9d01-6cd9116c1be4"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"CMP","subitem_subject_scheme":"Other"},{"subitem_subject":"Material removal","subitem_subject_scheme":"Other"},{"subitem_subject":"Slurry","subitem_subject_scheme":"Other"},{"subitem_subject":"AFM","subitem_subject_scheme":"Other"},{"subitem_subject":"Polishing","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"doctoral thesis","resourceuri":"http://purl.org/coar/resource_type/c_db06"}]},"item_title":"CMPプロセスの材料除去メカニズムにおけるスラリーの基本的機能に関する研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"CMPプロセスの材料除去メカニズムにおけるスラリーの基本的機能に関する研究","subitem_title_language":"ja"},{"subitem_title":"Study on basic functions of slurry for material removal mechanism in Chemical Mechanical Polishing process","subitem_title_language":"en"}]},"item_type_id":"20","owner":"18","path":["7"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2010-12-27"},"publish_date":"2010-12-27","publish_status":"0","recid":"3617","relation_version_is_last":true,"title":["CMPプロセスの材料除去メカニズムにおけるスラリーの基本的機能に関する研究"],"weko_creator_id":"18","weko_shared_id":-1},"updated":"2024-08-05T09:41:17.537413+00:00"}