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任意の材料組み合わせを考慮した縁界面き裂の応力拡大係数に関する研究
https://doi.org/10.18997/00003735
https://doi.org/10.18997/00003735a2f450f2-998f-432d-a709-292f6e3fb06d
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
D-152_kou_k_334.pdf (5.4 MB)
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| アイテムタイプ | 学位論文 = Thesis or Dissertation(1) | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| 公開日 | 2013-10-31 | |||||||||
| 資源タイプ | ||||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_db06 | |||||||||
| 資源タイプ | doctoral thesis | |||||||||
| タイトル | ||||||||||
| タイトル | Stress Intensity Factors of the Edge Interfacial Cracks for Arbitrary Material Combinations | |||||||||
| 言語 | en | |||||||||
| タイトル | ||||||||||
| タイトル | 任意の材料組み合わせを考慮した縁界面き裂の応力拡大係数に関する研究 | |||||||||
| 言語 | ja | |||||||||
| 言語 | ||||||||||
| 言語 | eng | |||||||||
| 著者 |
蘭, 欣
× 蘭, 欣
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| 抄録 | ||||||||||
| 内容記述タイプ | Abstract | |||||||||
| 内容記述 | Singular stress fields exist around the areas of the edge interface corners for two materials which are bonded together. And the presence of cracks affects the performances of a structure, and consequently causes a through-thickness crack which eventually results in the failure. The stress intensity factor is used to predict the stress state and the stable crack growth in fracture mechanics. Therefore, researches concerning the stress intensity factors of the edge interface cracks are the main focus of this research. The crack tip stress method based on FEM was improved to be able to solve the interface crack problems more efficiently. And a post-processing technology of linear extrapolation was proposed to improve the computational accuracy. Then, the improved crack tip stress method was applied to treat various edge interface crack problems. In this research, the stress intensity factors were computed for the whole range of material combinations and relative crack lengths. And the double logarithmic relationships between the stress intensity factors and the relative crack lengths were demonstrated for various material combinations. Then, approximate formulae of the stress intensity factors for arbitrary material combinations were given by fitting the computed results, for the single-edge cracked bonded dissimilar half-planes and shallow single edge-cracked bonded finite strips subjected to tensile and bending loading conditions. Furthermore, the contour map variations of the stress intensity factors in the whole material combinations space were demonstrated for a series of relative crack lengths. The maximum and minimum stress intensity factors were also obtained for various crack lengths. The single and double edge interface cracks were compared for the whole range of combination of materials and relative crack lengths. It was found that the stress intensity factors of a double-edge interface crack may possibly be larger than those of a single-edge interface crack for some specific material combinations and relative crack lengths. In addition, the stress intensity factors should be compared in three different zones according to the relative crack lengths. Finally, the variations of the stress intensity factors of the adhesive joints for various thicknesses of adhesive layers were also demonstrated for various material combinations. Specifically, the three-layered adhesive joints composed of Si (IC chip), resin and FR-4.5(substrate) which are widely used in the chip scale packaging (CSP) technology were investigated. And the effects of the thickness of the adhesive layers for CSP were also discussed in this research. | |||||||||
| 目次 | ||||||||||
| 内容記述タイプ | TableOfContents | |||||||||
| 内容記述 | Chapter1 Introduction||Chapter2 The improved crack tip stress method for interface cracks and post-processing technique||Chapter3 Stress intensity factors of the edge cracked bonded half-planes||Chapter4 Stress intensity factors of the single-edge-cracked bonded finite strip||Chapter5 Stress intensity factors of the double edge interface cracks||Chapter6 Stress intensity factors for adhesively bonded joints||Chapter7 Conclusions | |||||||||
| 備考 | ||||||||||
| 内容記述タイプ | Other | |||||||||
| 内容記述 | 九州工業大学博士学位論文 学位記番号:工博甲第334号 学位授与年月日:平成24年6月30日 | |||||||||
| キーワード | ||||||||||
| 主題Scheme | Other | |||||||||
| 主題 | edge interface crack | |||||||||
| キーワード | ||||||||||
| 主題Scheme | Other | |||||||||
| 主題 | stress intenssity fachrs | |||||||||
| キーワード | ||||||||||
| 主題Scheme | Other | |||||||||
| 主題 | material combinatins | |||||||||
| キーワード | ||||||||||
| 主題Scheme | Other | |||||||||
| 主題 | londing strength | |||||||||
| キーワード | ||||||||||
| 主題Scheme | Other | |||||||||
| 主題 | elashc bi-material strip | |||||||||
| アドバイザー | ||||||||||
| 野田, 尚昭 | ||||||||||
| 学位授与番号 | ||||||||||
| 学位授与番号 | 甲第334号 | |||||||||
| 学位名 | ||||||||||
| 学位名 | 博士（工学） | |||||||||
| 学位授与年月日 | ||||||||||
| 学位授与年月日 | 2012-06-30 | |||||||||
| 学位授与機関 | ||||||||||
| 学位授与機関識別子Scheme | kakenhi | |||||||||
| 学位授与機関識別子 | 17104 | |||||||||
| 学位授与機関名 | 九州工業大学 | |||||||||
| 学位授与年度 | ||||||||||
| 内容記述タイプ | Other | |||||||||
| 内容記述 | 平成24年度 | |||||||||
| 出版タイプ | ||||||||||
| 出版タイプ | VoR | |||||||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||||||
| アクセス権 | ||||||||||
| アクセス権 | open access | |||||||||
| アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||||||
| ID登録 | ||||||||||
| ID登録 | 10.18997/00003735 | |||||||||
| ID登録タイプ | JaLC | |||||||||
