WEKO3
アイテム
High-throughput DBC-assembled IGBT screening for power module
http://hdl.handle.net/10228/5742
http://hdl.handle.net/10228/5742b06a1f71-aec3-4f6b-ac34-499313d5ae3f
| 名前 / ファイル | ライセンス | アクション |
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| アイテムタイプ | 会議発表論文 = Conference Paper(1) | |||||||||||
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| 公開日 | 2016-09-13 | |||||||||||
| 資源タイプ | ||||||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||||||||
| 資源タイプ | conference paper | |||||||||||
| タイトル | ||||||||||||
| タイトル | High-throughput DBC-assembled IGBT screening for power module | |||||||||||
| 言語 | en | |||||||||||
| 言語 | ||||||||||||
| 言語 | eng | |||||||||||
| 著者 |
Tsukuda, Masanori
× Tsukuda, Masanori× Okoda, Seiichi× Noda, Ryuzo× Tashiro, Katsuji× 大村, 一郎
WEKO
16176
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| 抄録 | ||||||||||||
| 内容記述タイプ | Abstract | |||||||||||
| 内容記述 | High-throughput DBC-assembled IGBT screening equipment for a production line is under development in order to prevent early failure of power modules. The equipment has been planning to have automatic GO/NO GO judgment technology by high-throughput measurement of current signal distribution with non-contact sensor arrays with small coils over the bonding wires of IGBT chips. Basic technology and Prototypes of a sensor, an analog amplifier, digital compensation technology, a test head and power circuit have been almost completed. The authors will fabricate the sensor arrays and develop GO/NO GO judgement technology with the integration of a basic technology. | |||||||||||
| 備考 | ||||||||||||
| 内容記述タイプ | Other | |||||||||||
| 内容記述 | 8th International Conference on Integrated Power Electronics Systems (CIPS 2014), February 25-27, 2014, Nuremberg, Germany | |||||||||||
| 書誌情報 |
2014 8th International Conference on Integrated Power Electronics Systems p. 1-6, 発行日 2014-02 |
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| 出版社 | ||||||||||||
| 出版社 | Vde Verlag | |||||||||||
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| 権利情報 | IEEE | |||||||||||
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| 出版タイプ | AM | |||||||||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||
| 査読の有無 | ||||||||||||
| 値 | yes | |||||||||||
| 連携ID | ||||||||||||
| 値 | 5582 | |||||||||||