@inproceedings{oai:kyutech.repo.nii.ac.jp:00004541,
 author = {山口, 治之 and 附田, 正則 and Watanabe, Akihiko and 渡邉, 晃彦 and Omura, Ichiro and 大村, 一郎},
 book = {電気学会研究会資料. EDD, 電子デバイス研究会},
 month = {Oct},
 note = {IGBT modules need to have higher reliability since their demand is expanding. To realize highly reliable modules, an ultra-small PCB current probe was developed, which enables to measure current imbalance among chips without changing inside structure of the module. This technique can be applied to wiring design and built-in current sensing for highly reliable module., 電子デバイス/半導体電力変換合同研究会, 10月30日-31日, 2014年, 産業技術総合研究所 TIAナノ連携棟, 茨城県},
 publisher = {社団法人電気学会},
 title = {IGBTモジュール高信頼化に向けたチップ間電流不均衡計測技術の開発},
 volume = {EDD-14},
 year = {2014},
 yomi = {ワタナベ, アキヒコ and オオムラ, イチロウ}
}