{"created":"2023-05-15T11:58:30.863020+00:00","id":4552,"links":{},"metadata":{"_buckets":{"deposit":"6e67e659-02c2-4e0d-9f14-ce10cccc70ed"},"_deposit":{"created_by":3,"id":"4552","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"4552"},"status":"published"},"_oai":{"id":"oai:kyutech.repo.nii.ac.jp:00004552","sets":["15:20"]},"author_link":["16383","16384","16385","16176"],"control_number":"4552","item_23_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2012-06","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"290","bibliographicPageStart":"287","bibliographic_titles":[{"bibliographic_title":"2012 24th International Symposium on Power Semiconductor Devices and Ics","bibliographic_titleLang":"en"}]}]},"item_23_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Bonding wire current measurement technique has been highly desired to analyze failure phenomena, such as short circuit and avalanche destruction of IGBT and power diode. This paper challenged to measure bonding wire current distribution in an IGBT module with the multiple tiny film current sensors and the digital calculation technique. The authors successfully measured bonding wire current under a single shot measurement.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_23_description_5":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_description":"2012 24th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2012), June 3-7, 2012, Bruges, Belgium","subitem_description_language":"en","subitem_description_type":"Other"}]},"item_23_publisher_7":{"attribute_name":"出版社","attribute_value_mlt":[{"subitem_publisher":"IEEE"}]},"item_23_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/ISPSD.2012.6229079","subitem_relation_type_select":"DOI"}}]},"item_23_rights_13":{"attribute_name":"著作権関連情報","attribute_value_mlt":[{"subitem_rights":"IEEE"}]},"item_23_select_59":{"attribute_name":"査読の有無","attribute_value_mlt":[{"subitem_select_item":"yes"}]},"item_23_text_62":{"attribute_name":"連携ID","attribute_value_mlt":[{"subitem_text_value":"5564"}]},"item_23_version_type_58":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Hirai, Hidetoshi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"16383","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kasho, Yuya","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"16384","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tsukuda, Masanori","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"16385","nameIdentifierScheme":"WEKO"}]},{"creatorAffiliations":[{"affiliationNames":[{"affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"Omura, Ichiro","creatorNameLang":"en"},{"creatorName":"大村, 一郎","creatorNameLang":"ja"},{"creatorName":"オオムラ, イチロウ","creatorNameLang":"ja-Kana"}],"familyNames":[{"familyName":"Omura","familyNameLang":"en"},{"familyName":"大村","familyNameLang":"ja"},{"familyName":"オオムラ","familyNameLang":"ja-Kana"}],"givenNames":[{"givenName":"Ichiro","givenNameLang":"en"},{"givenName":"一郎","givenNameLang":"ja"},{"givenName":"イチロウ","givenNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"16176","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"10510670","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000010510670"},{"nameIdentifier":"7003814580","nameIdentifierScheme":"Scopus著者ID","nameIdentifierURI":"https://www.scopus.com/authid/detail.uri?authorId=7003814580"},{"nameIdentifier":"69","nameIdentifierScheme":"九工大研究者情報","nameIdentifierURI":"https://hyokadb02.jimu.kyutech.ac.jp/html/69_ja.html"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-09-13"}],"displaytype":"detail","filename":"nperc15.pdf","filesize":[{"value":"600.0 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"nperc15.pdf","url":"https://kyutech.repo.nii.ac.jp/record/4552/files/nperc15.pdf"},"version_id":"09dbaaf3-1cab-4e6d-91e0-95ed3ec0e27a"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"component","subitem_subject_scheme":"Other"},{"subitem_subject":"bonding wire current mesurement","subitem_subject_scheme":"Other"},{"subitem_subject":"film current sensor with tiny-scale coils","subitem_subject_scheme":"Other"},{"subitem_subject":"high speed analog amplifiers","subitem_subject_scheme":"Other"},{"subitem_subject":"digital calculation technique","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"conference paper","resourceuri":"http://purl.org/coar/resource_type/c_5794"}]},"item_title":"Bonding Wire Current Measurementwith Tiny Film Current Sensors","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Bonding Wire Current Measurementwith Tiny Film Current Sensors","subitem_title_language":"en"}]},"item_type_id":"23","owner":"3","path":["20"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2016-09-13"},"publish_date":"2016-09-13","publish_status":"0","recid":"4552","relation_version_is_last":true,"title":["Bonding Wire Current Measurementwith Tiny Film Current Sensors"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2025-04-15T01:54:14.192814+00:00"}