{"created":"2023-05-15T11:58:32.045033+00:00","id":4580,"links":{},"metadata":{"_buckets":{"deposit":"c5e072a7-cf21-473f-941d-d45007474a81"},"_deposit":{"created_by":3,"id":"4580","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"4580"},"status":"published"},"_oai":{"id":"oai:kyutech.repo.nii.ac.jp:00004580","sets":["15:20"]},"author_link":["16517","3665"],"control_number":"4580","item_21_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2014-08-12","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"1234","bibliographicPageStart":"1229","bibliographic_titles":[{"bibliographic_title":"2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014)"}]}]},"item_21_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"The effects the thickness of epoxy resin on the stress intensity factors (SIFs) of the edge-cracked adhesive joints subjected to external loads are investigated in the current paper. The three-layered joints composed of Silicon, epoxy resin and FR-4.5 are widely seen in the package solutions of CSP/FBGA for electronic devices. Cracks or delaminations from resin-substrate interface or resin-silicon interface are the common failure modes in plastic IC packages. However, it is difficult to determine the exact stress state of a bi-material interface due to the oscillatory singularity. In this paper, the SIFs of the single edge-cracked joints are determined accurately by using the Crack Tip Stress Method. Then, the effects of resin thickness on the SIFs of various edge interface cracks under uniform tension are investigated by varying the resin thickness and crack length. It was found that the SIFs grow with the increment of resin thickness and reach constants when the resin thickness is larger than the width of the joint.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_21_description_5":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_description":"2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), August 12-15, 2014, Chengdu, China","subitem_description_type":"Other"}]},"item_21_link_62":{"attribute_name":"研究者情報","attribute_value_mlt":[{"subitem_link_text":"https://hyokadb02.jimu.kyutech.ac.jp/html/10_ja.html","subitem_link_url":"https://hyokadb02.jimu.kyutech.ac.jp/html/10_ja.html"}]},"item_21_publisher_7":{"attribute_name":"出版社","attribute_value_mlt":[{"subitem_publisher":"IEEE"}]},"item_21_relation_12":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/ICEPT.2014.6922865","subitem_relation_type_select":"DOI"}}]},"item_21_rights_13":{"attribute_name":"著作権関連情報","attribute_value_mlt":[{"subitem_rights":"Copyright (c) 2014 IEEE. Personal use of this material is permitted.  Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works."}]},"item_21_select_59":{"attribute_name":"査読の有無","attribute_value_mlt":[{"subitem_select_item":"yes"}]},"item_21_text_63":{"attribute_name":"連携ID","attribute_value_mlt":[{"subitem_text_value":"5609"}]},"item_21_version_type_58":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Lan, Xin","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"16517","nameIdentifierScheme":"WEKO"}]},{"creatorAffiliations":[{"affiliationNames":[{"affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"Noda, Nao-Aki","creatorNameLang":"en"},{"creatorName":"野田, 尚昭","creatorNameLang":"ja"},{"creatorName":"ノダ, ナオアキ","creatorNameLang":"ja-Kana"}],"familyNames":[{"familyName":"Noda","familyNameLang":"en"},{"familyName":"野田","familyNameLang":"ja"},{"familyName":"ノダ","familyNameLang":"ja-Kana"}],"givenNames":[{"givenName":"Nao-Aki","givenNameLang":"en"},{"givenName":"尚昭","givenNameLang":"ja"},{"givenName":"ナオアキ","givenNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"3665","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"40172796","nameIdentifierScheme":"e-Rad_Researcher","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000040172796"},{"nameIdentifier":"7202782903","nameIdentifierScheme":"Scopus著者ID","nameIdentifierURI":"https://www.scopus.com/authid/detail.uri?authorId=7202782903"},{"nameIdentifier":"0000-0002-6067-3122","nameIdentifierScheme":"ORCiD","nameIdentifierURI":"https://orcid.org/0000-0002-6067-3122"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2016-09-23"}],"displaytype":"detail","filename":"ICEPT2014_1229.pdf","filesize":[{"value":"332.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"ICEPT2014_1229.pdf","url":"https://kyutech.repo.nii.ac.jp/record/4580/files/ICEPT2014_1229.pdf"},"version_id":"263d5248-ce0a-44ae-a8a6-fdb99540fda6"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Stress intensity factors","subitem_subject_scheme":"Other"},{"subitem_subject":"Stress singularity","subitem_subject_scheme":"Other"},{"subitem_subject":"Adhesive joints","subitem_subject_scheme":"Other"},{"subitem_subject":"Edge interface crack","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints","subitem_title_language":"en"}]},"item_type_id":"21","owner":"3","path":["20"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2016-09-23"},"publish_date":"2016-09-23","publish_status":"0","recid":"4580","relation_version_is_last":true,"title":["Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints"],"weko_creator_id":"3","weko_shared_id":3},"updated":"2025-05-02T04:51:09.530943+00:00"}