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A novel method of computing the Stess intensity factors of the interfacial cracks
http://hdl.handle.net/10228/5800
http://hdl.handle.net/10228/5800ee6ae875-c0df-424e-8a9f-8b9608d1f21f
| 名前 / ファイル | ライセンス | アクション |
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ICEPT2015_1238.pdf (216.7 kB)
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| アイテムタイプ | 会議発表論文 = Conference Paper(1) | |||||||||||
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| 公開日 | 2016-09-23 | |||||||||||
| 資源タイプ | ||||||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||||||||
| 資源タイプ | conference paper | |||||||||||
| タイトル | ||||||||||||
| タイトル | A novel method of computing the Stess intensity factors of the interfacial cracks | |||||||||||
| 言語 | en | |||||||||||
| 言語 | ||||||||||||
| 言語 | eng | |||||||||||
| 著者 |
Lan, Xin
× Lan, Xin× 野田, 尚昭
WEKO
3665
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| 抄録 | ||||||||||||
| 内容記述タイプ | Abstract | |||||||||||
| 内容記述 | Bi-material interface and multi-layer systems are widely observed in modern microelectronic applications. When the external load reaches a critical level, the crack either extends along the interface or kinks out of the interface, and finally leads to the catastrophic failure. In fracture mechanics, stress intensity factor, mode mix ratio and strain energy release rate are normally used as parameters to evaluate the adhesive toughness and failure prediction of bi-material interfaces. In this research, a new efficient method based on the finite elements and the extended proportional method using nodal-displacement behind the crack tip was introduced to obtain the stress intensity factors, then the strain energy release rate could be computed by using its relationship with the stress intensity factors. The robustness and accuracy of the current proposed method was discussed by comparing the solution results proposed by other researchers. It was found that the average error is less than 1% for the stress intensity factors, and it can get accurate results with rather coarse finite element meshes. Furthermore, the current method is fairly efficient and less computational resource consuming. The current method could be used as an effective tool in the reliability analysis of the bonded multi-layers in microelectronics. | |||||||||||
| 備考 | ||||||||||||
| 内容記述タイプ | Other | |||||||||||
| 内容記述 | 16th International Conference on Electronic Packaging Technology (ICEPT 2015), August 11-14, 2015, Changsha, China | |||||||||||
| 書誌情報 |
2015 16th International Conference on Electronic Packaging Technology (ICEPT) p. 1238-1241, 発行日 2015-08-11 |
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| 出版社 | ||||||||||||
| 出版社 | IEEE | |||||||||||
| DOI | ||||||||||||
| 関連タイプ | isVersionOf | |||||||||||
| 識別子タイプ | DOI | |||||||||||
| 関連識別子 | https://doi.org/10.1109/ICEPT.2015.7236803 | |||||||||||
| 著作権関連情報 | ||||||||||||
| 権利情報 | Copyright (c) 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | stress intensity factor | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | mode mix ratio | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | finite element method | |||||||||||
| 出版タイプ | ||||||||||||
| 出版タイプ | AM | |||||||||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||
| 査読の有無 | ||||||||||||
| 値 | yes | |||||||||||
| 研究者情報 | ||||||||||||
| URL | https://hyokadb02.jimu.kyutech.ac.jp/html/10_ja.html | |||||||||||
| 連携ID | ||||||||||||
| 値 | 5608 | |||||||||||
