@inproceedings{oai:kyutech.repo.nii.ac.jp:00004861,
 author = {Noda,  Nao-Aki and Zhang,  Yu and Takaishi,  Ken-Tarou and Shibahara,  Hiroyuki},
 book = {International Journal of Mechanical, Aerospace, Industrial, Mechatronic and Manufacturing Engineering},
 issue = {7},
 month = {Jul},
 note = {In this paper the strength of adhesive joint under tension and bending is discussed on the basis of intensity of singular stress by the application of FEM. A useful method is presented with focusing on the stress at the edge of interface between the adhesive and adherent obtained by FEM. After analyzing the adhesive joint strength with all material combinations, it is found that to improve the interface strength, thin adhesive layers are desirable because the intensity of singular stress decreases with decreasing the thickness., WASET 2011:INTERNATIONAL CONFERENCE PROGRAM Holiday Inn Paris Montparnesse-Avenue du Maine, June 24-26, 2011, Paris, France},
 pages = {1388--1393},
 publisher = {World Academy of Science, Engineering and Technology},
 title = {Intensity of Singular Stress Field at the Corner of Adhesive Layer in Bonded Plate},
 volume = {5},
 year = {2011}
}