@article{oai:kyutech.repo.nii.ac.jp:00004941,
 author = {Wada,  Tomohiro and Masui, Hirokazu and 増井, 博一 and Toyoda, Kazuhiro and 豊田, 和弘 and Cho, Mengu and 趙, 孟佑},
 issue = {ists27},
 journal = {Transactions of the Japan Society for Aeronautical and Space Sciences, Space Technology Japan},
 month = {Apr},
 note = {The recent trend of satellite manufacturing is to increase its communication capacity, multi-purpose mission payload, electric power and lifetime. A short-circuit due to discharge on the solar array of the satellite hampers its target by causing serious problems, such as, lowering of power generation that ultimately halts the operation of solar array. In this paper, we have investigated possible mitigation methods against short-circuit due to discharge on solar array by applying coating and by changing the shape of Room Temperature Vulcanization: Silicon adhesive (RTV). The electrostatic discharge is mitigated by obtaining the event of secondary arc generated on each condition., The 27th International Symposium on Space Technology and Science, July 5-12, 2009, EPOCHAL TSUKUBA, Ibaraki, Japan},
 pages = {Pr_2_19--Pr_2_24},
 title = {Research on Mitigation Method against Secondary Arcing on Solar Array},
 volume = {8},
 year = {2011},
 yomi = {マスイ, ヒロカズ and トヨダ, カズヒロ and チヨウ, メンウ}
}