{"created":"2023-05-15T11:59:10.786814+00:00","id":5488,"links":{},"metadata":{"_buckets":{"deposit":"f90b34e1-900c-4a9d-b0d2-58df60b61d09"},"_deposit":{"created_by":3,"id":"5488","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"5488"},"status":"published"},"_oai":{"id":"oai:kyutech.repo.nii.ac.jp:00005488","sets":["15:20"]},"author_link":["16176","22191","16333"],"item_23_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicVolumeNumber":"2017","bibliographic_titles":[{"bibliographic_title":"2017 International Conference on Solid State Devices and Materials (SSDM2017)"}]}]},"item_23_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":" We propose an imaging method of temperature dis-tribution inside a power device in real-time. The imaging system was constructed by integrating a real-time moni-toring and a real-time simulation. The surface tempera-tures of a device under test (DUT) is monitored by in-frared cameras and a high speed temperature simulator calculates temperature distribution inside the DUT by using the surface temperatures as boundary conditions. Our system successively imaged inside temperature dis-tribution of a TO packaged power diode under power cycling test with frame rate of 1 fps.","subitem_description_type":"Abstract"}]},"item_23_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"2017 International Conference on Solid State Devices and Materials (SSDM2017), Sendai International Center, Sendai, Japan, Sep.19-22,2017","subitem_description_type":"Other"}]},"item_23_description_60":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"subitem_description":"Conference Paper","subitem_description_type":"Other"}]},"item_23_publisher_7":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"社団法人応用物理学会"}]},"item_23_rights_13":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"©2017 The Japan Society of Applied Physics"}]},"item_23_select_59":{"attribute_name":"査読の有無","attribute_value_mlt":[{"subitem_select_item":"yes"}]},"item_23_text_37":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"Kyushu Institute of Technology"}]},"item_23_text_62":{"attribute_name":"連携ID","attribute_value_mlt":[{"subitem_text_value":"6593"}]},"item_23_version_type_58":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorAffiliations":[{"affiliationNameIdentifiers":[],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"Watanabe, Akihiko","creatorNameLang":"en"},{"creatorName":"渡邉, 晃彦","creatorNameLang":"ja"},{"creatorName":"ワタナベ, アキヒコ","creatorNameLang":"ja-Kana"}],"familyNames":[{"familyName":"Watanabe","familyNameLang":"en"},{"familyName":"渡邉","familyNameLang":"ja"},{"familyName":"ワタナベ","familyNameLang":"ja-Kana"}],"givenNames":[{"givenName":"Akihiko","givenNameLang":"en"},{"givenName":"晃彦","givenNameLang":"ja"},{"givenName":"アキヒコ","givenNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"16333","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"80363406","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000080363406"},{"nameIdentifier":"55197191200","nameIdentifierScheme":"Scopus著者ID","nameIdentifierURI":"https://www.scopus.com/authid/detail.uri?authorId=55197191200"},{"nameIdentifier":"89","nameIdentifierScheme":"九工大研究者情報","nameIdentifierURI":"https://hyokadb02.jimu.kyutech.ac.jp/html/89_ja.html"}]},{"creatorNames":[{"creatorName":"Nagao,  Ryosuke"}],"nameIdentifiers":[{"nameIdentifier":"22191","nameIdentifierScheme":"WEKO"}]},{"creatorAffiliations":[{"affiliationNameIdentifiers":[],"affiliationNames":[{"affiliationName":"","affiliationNameLang":"ja"}]}],"creatorNames":[{"creatorName":"Omura, Ichiro","creatorNameLang":"en"},{"creatorName":"大村, 一郎","creatorNameLang":"ja"},{"creatorName":"オオムラ, イチロウ","creatorNameLang":"ja-Kana"}],"familyNames":[{"familyName":"Omura","familyNameLang":"en"},{"familyName":"大村","familyNameLang":"ja"},{"familyName":"オオムラ","familyNameLang":"ja-Kana"}],"givenNames":[{"givenName":"Ichiro","givenNameLang":"en"},{"givenName":"一郎","givenNameLang":"ja"},{"givenName":"イチロウ","givenNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"16176","nameIdentifierScheme":"WEKO"},{"nameIdentifier":"10510670","nameIdentifierScheme":"e-Rad","nameIdentifierURI":"https://nrid.nii.ac.jp/ja/nrid/1000010510670"},{"nameIdentifier":"7003814580","nameIdentifierScheme":"Scopus著者ID","nameIdentifierURI":"https://www.scopus.com/authid/detail.uri?authorId=7003814580"},{"nameIdentifier":"69","nameIdentifierScheme":"九工大研究者情報","nameIdentifierURI":"https://hyokadb02.jimu.kyutech.ac.jp/html/69_ja.html"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-04-02"}],"displaytype":"detail","filename":"nperc91.pdf","filesize":[{"value":"1.1 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"nperc91.pdf","url":"https://kyutech.repo.nii.ac.jp/record/5488/files/nperc91.pdf"},"version_id":"8c6edada-9dc4-4b76-89e5-9ed2173af811"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"conference paper","resourceuri":"http://purl.org/coar/resource_type/c_5794"}]},"item_title":"Temperature Distribution Imaging inside Power Devices by Real-Time Simulation","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Temperature Distribution Imaging inside Power Devices by Real-Time Simulation"}]},"item_type_id":"23","owner":"3","path":["20"],"pubdate":{"attribute_name":"公開日","attribute_value":"2018-04-02"},"publish_date":"2018-04-02","publish_status":"0","recid":"5488","relation_version_is_last":true,"title":["Temperature Distribution Imaging inside Power Devices by Real-Time Simulation"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2025-04-15T01:52:13.651990+00:00"}