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Design Consideration of a 3D Stacked Power Supply on Chip
http://hdl.handle.net/10228/00007014
http://hdl.handle.net/10228/00007014a54d4d17-a8a8-44eb-b41a-adb0f02140d5
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
nperc122.pdf (683.5 kB)
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| アイテムタイプ | 会議発表論文 = Conference Paper(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2019-02-15 | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||
| 資源タイプ | conference paper | |||||
| タイトル | ||||||
| タイトル | Design Consideration of a 3D Stacked Power Supply on Chip | |||||
| 言語 | en | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| 著者 |
Ono, Kota
× Ono, Kota× Hiura, Kengo× Matsumoto, Sathoshi |
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| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | In recent years, miniaturization and thinning of the power supply are attracted attentions. In this paper, we discuss the structure for the on-chip inductor and assembly technology suitable for 3D power SoC, which stacks GaN power device, passive devices, control circuit, and driver, based on wafer direct bonding technology and clarified the potential of the high frequency switching applications. We also propose the optimum structure and technology according to the switching frequency based on simulations. | |||||
| 備考 | ||||||
| 内容記述タイプ | Other | |||||
| 内容記述 | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 29 May-1 June 2018, San Diego, CA, USA | |||||
| 書誌情報 |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 発行日 2018-06-01 |
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| 出版社 | ||||||
| 出版社 | IEEE | |||||
| DOI | ||||||
| 関連タイプ | isVersionOf | |||||
| 識別子タイプ | DOI | |||||
| 関連識別子 | https://doi.org/10.1109/ECTC.2018.00196 | |||||
| ISBN | ||||||
| 識別子タイプ | ISBN | |||||
| 関連識別子 | 978-1-5386-4999-2 | |||||
| ISBN | ||||||
| 識別子タイプ | ISBN | |||||
| 関連識別子 | 978-1-5386-5000-4 | |||||
| ISSN | ||||||
| 収録物識別子タイプ | EISSN | |||||
| 収録物識別子 | 2377-5726 | |||||
| 著作権関連情報 | ||||||
| 権利情報 | © 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | high frequency DC-DC converter | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | on chip inductor | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | on chip capacitor | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | assembry technology | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | 3D stack power supply on chip | |||||
| 出版タイプ | ||||||
| 出版タイプ | AM | |||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
| 査読の有無 | ||||||
| 値 | yes | |||||
| 連携ID | ||||||
| 値 | 7545 | |||||
