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アイテム
サファイア研磨における10nm以下のナノシリカ微粒子を適用した機能性ハイブリッドナノ微粒子の特異性に関する研究
https://doi.org/10.18997/00007199
https://doi.org/10.18997/000071993664a663-0be8-4e71-a17f-75f2311723ba
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
jou_k_341.pdf (5.8 MB)
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| アイテムタイプ | 学位論文 = Thesis or Dissertation(1) | |||||||
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| 公開日 | 2019-06-13 | |||||||
| 資源タイプ | ||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_db06 | |||||||
| 資源タイプ | doctoral thesis | |||||||
| タイトル | ||||||||
| タイトル | Novel Characteristics of Sub-10 nm Silica Particles for Hybrid Fine Particles in Chemical Mechanical Polishing of Sapphire | |||||||
| 言語 | en | |||||||
| タイトル | ||||||||
| タイトル | サファイア研磨における10nm以下のナノシリカ微粒子を適用した機能性ハイブリッドナノ微粒子の特異性に関する研究 | |||||||
| 言語 | ja | |||||||
| 言語 | ||||||||
| 言語 | eng | |||||||
| 著者 |
Bun-Athuek, Natthaphon
× Bun-Athuek, Natthaphon
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| 抄録 | ||||||||
| 内容記述タイプ | Abstract | |||||||
| 内容記述 | The ultrafine silica particles size of smaller than 10 nm exhibit the unique characteristics to produce the hybrid fine particles for improving the performance of chemical mechanical polishing （CMP） of sapphire. The hybrid fine particles are formed by ultrafine （4 nm） silica particles mixed with the larger （20 nm, 55 nm, and 105 nm） silica particles. The hybrid fine particles could control the chemical reactivity by ultrafine silica particles and the mechanical action from larger silica particles independently. The evanescent field light observation results specified that the ultrafine silica particles size of smaller than 10 nm are adsorbed on the surface of sapphire substrates. The transmission electron microscopy （TEM） and dynamic light scattering （DLS） results revealed the structure of hybrid fine particles. The hybrid fine particles were produced from ultrafine colloidal silica particles adhered to the surfaces of large silica particles thereby changed the surface condition by novel characteristics on the nano size particles. The polishing results showed that the hybrid fine particles enabled a much higher performance of sapphire CMP than the conventional single-sized silica particles owing to the ultrafine silica enhanced the chemical reactivity to produce the reacted layer （alumina silicate）. The material removal rate of sapphire was also increased due to the coefficient of friction （COF） of contact area between the sapphire substrate, polishing pad, and fine particles was increased. The hybrid fine particles might be modified by the ultrafine silica particles that adhered to the surface of larger silica particles. Chapter 2 shows the method to specify the dominant characteristics （mechanical action or chemical reactivity） of single-sized silica particles by using evanescent field light observation. We found that the boundary of dominant characteristics of ultrafine silica particles appear at the size of smaller than 10 nm. Chapter 3 presents the method to prepare the hybrid fine particles by mixing process. The characterization of hybrid fine particles by TEM and DLS was also explained. Chapter 4 describes the performance of sapphire CMP process by using the hybrid fine particles as the abrasive in the slurry. Furthermore, the method to investigate the effects of ultrafine silica particles on the material removal rate of sapphire was also presented. Chapter 5 shows the optimization of hybrid fine particles. We found that the performance of sapphire CMP depends on the diameter size of large silica particle and the number ratio of ultrafine silica and larger silica particles in the slurry. The concept to optimize the performance of hybrid fine particles in sapphire CMP by varying the three parameters such as the diameter size of the larger silica particles, the reactivity, and the surface condition. The supposed model of sapphire removal by hybrid fine particles was also proposed. Finally, we conclude that / 1. The ultrafine silica particles size of smaller than 10 nm exhibited the unique characteristics, it performed high material removal rate. / 2. The hybrid fine particles gave higher material removal rate for sapphire than single-sized silica slurries. / 3. The ultrafine silica particles and hybrid fine particles also improved the surface roughness of sapphire. | |||||||
| 言語 | en | |||||||
| 目次 | ||||||||
| 内容記述タイプ | TableOfContents | |||||||
| 内容記述 | 1 Introduction||2 Characteristics of fine silica particles in sapphire CMP||3 The hybrid fine particles||4 Performance of hybrid fine particles||5 Performance optimization of hybrid fine particles||6 Conclusions | |||||||
| 備考 | ||||||||
| 内容記述タイプ | Other | |||||||
| 内容記述 | 九州工業大学博士学位論文 学位記番号：情工博甲第341号 学位授与年月日：平成31年3月25日 | |||||||
| キーワード | ||||||||
| 主題Scheme | Other | |||||||
| 主題 | Silica particles | |||||||
| キーワード | ||||||||
| 主題Scheme | Other | |||||||
| 主題 | Hybrid fine particles | |||||||
| キーワード | ||||||||
| 主題Scheme | Other | |||||||
| 主題 | Novel characteristics | |||||||
| キーワード | ||||||||
| 主題Scheme | Other | |||||||
| 主題 | CMP | |||||||
| キーワード | ||||||||
| 主題Scheme | Other | |||||||
| 主題 | Sapphire | |||||||
| アドバイザー | ||||||||
| 鈴木, 恵友 | ||||||||
| 学位授与番号 | ||||||||
| 学位授与番号 | 甲第341号 | |||||||
| 学位名 | ||||||||
| 学位名 | 博士（情報工学） | |||||||
| 学位授与年月日 | ||||||||
| 学位授与年月日 | 2019-03-25 | |||||||
| 学位授与機関 | ||||||||
| 学位授与機関識別子Scheme | kakenhi | |||||||
| 学位授与機関識別子 | 17104 | |||||||
| 学位授与機関名 | 九州工業大学 | |||||||
| 学位授与年度 | ||||||||
| 内容記述タイプ | Other | |||||||
| 内容記述 | 平成30年度 | |||||||
| 出版タイプ | ||||||||
| 出版タイプ | VoR | |||||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||||
| アクセス権 | ||||||||
| アクセス権 | open access | |||||||
| アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||||
| ID登録 | ||||||||
| ID登録 | 10.18997/00007199 | |||||||
| ID登録タイプ | JaLC | |||||||
