@article{oai:kyutech.repo.nii.ac.jp:00006609,
 author = {Noda, Nao-Aki and 野田, 尚昭 and Ren,  Fei and Takaki,  Rei and Wang,  Zefeng and Oda,  Kazuhiro and Miyazaki,  Tatsujiro and Sano, Yoshikazu and 佐野, 義一},
 journal = {International Journal of Adhesion and Adhesives},
 month = {Jun},
 note = {Our previous research has indicated that the bonded strength can be expressed in terms of the intensity of the singular stress field (ISSF). Since the ISSF is quite useful for evaluating the bonded strength, in this study, the variation of the ISSF is investigated over the entire bondline thickness range of plate and cylinder butt joints. Here, an effective mesh-independent technique combined with a standard FEM approach is used to obtain the ISSFs under arbitrary material combinations. A reference solution of simply bonded plate is used to eliminate FEM error since the exact ISSF is available. This paper clarifies the differences between the fracture behaviors of the bonded plate and cylindrical butt joints.},
 pages = {234--250},
 title = {Intensity of Singular Stress Field over the Entire Bond Line Thickness Range Useful for Evaluating the Adhesive Strength for Plate and Cylinder Butt Joints},
 volume = {85},
 year = {2018},
 yomi = {ノダ, ナオアキ and サノ, ヨシカズ}
}