@article{oai:kyutech.repo.nii.ac.jp:00006701,
 author = {Watanabe, Akihiko and 渡邉, 晃彦 and Omura, Ichiro and 大村, 一郎},
 journal = {Microelectronics Reliability},
 month = {Sep},
 note = {We have proposed a failure analysis based on a real-time monitoring of power devices under acceleration test. The real-time monitoring enables to visualize the mechanism that leads to a failure by obtaining the change of structure inside the device in time domain with high spatial resolution. In this paper, we presented a new analytical instrument based on the proposed failure analysis concept. The essential functions of this instrument are (1) power stress control, (2) non-destructive inspection and (3) water circulation. An original design power-stress control system and a customized scanning acoustic microscopy system enable us a non-destructive inspection inside the device under power cycling test. This instrument exhibits a great advantage especially to monitor failure mechanisms without having to open the module.},
 pages = {458--461},
 title = {A power cycling degradation inspector of power semiconductor devices},
 volume = {88-90},
 year = {2018},
 yomi = {ワタナベ, アキヒコ and オオムラ, イチロウ}
}