{"created":"2023-05-15T12:00:56.212230+00:00","id":7943,"links":{},"metadata":{"_buckets":{"deposit":"17ee67b7-2ed5-4e81-b138-6a059defa04a"},"_deposit":{"created_by":3,"id":"7943","owners":[3],"pid":{"revision_id":0,"type":"depid","value":"7943"},"status":"published"},"_oai":{"id":"oai:kyutech.repo.nii.ac.jp:00007943","sets":["8:24"]},"author_link":["35075","35076","35077","35078","27142","35080"],"control_number":"7943","item_1689815586683":{"attribute_name":"CRID","attribute_value_mlt":[{"subitem_relation_type":"isIdenticalTo","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://cir.nii.ac.jp/crid/1050858608274375040","subitem_relation_type_select":"URI"}}]},"item_21_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2023-01-12","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"343","bibliographicPageEnd":"88","bibliographicPageStart":"83","bibliographicVolumeNumber":"122","bibliographic_titles":[{"bibliographic_title":"電子情報通信学会技術研究報告. EE, 電子通信エネルギー技術","bibliographic_titleLang":"ja"}]}]},"item_21_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"電源の小型化と高効率化を可能にするために，Si based ICとGaNパワーデバイスを3次元に積層した3次元パワーICが注目を集めている．3次元構造にすることで寄生インピーダンスが低減し，ヘテロジニアス構造によりGaNを使用できるため，高周波で高効率動作が可能になる．一方で，電源内部で発生する熱は性能に悪影響を与え，小型化することで電磁界や熱などの物理現象との相互作用がさらに大きくなる．本研究では，3次元パワーICの設計手法として，デバイスシミュレーション，回路シミュレーション，電磁界シミュレーション，熱流体シミュレーーションを組み合わせたVirtual Prototyping方法を提案する．またこれ用いた電源の小型化に向けた設計例を紹介する．","subitem_description_language":"ja","subitem_description_type":"Abstract"},{"subitem_description":"3D power IC, which integrates Si based IC and Gallium Nitride (GaN) power devices realizes high efficiency at high frequency switching and high-power density. However, miniaturization makes 3D power IC high temperature, and the interaction of electromagnetic field and heat are increased. In this paper, we propose a virtual prototyping technique, which is coupling of thermal-device, heat conduction, thermal-electromagnetic, and thermal-circuit simulation to design the 3D power IC. In addition, we introduce an example of design for miniaturization of power supply using virtual prototyping.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_21_description_5":{"attribute_name":"備考","attribute_value_mlt":[{"subitem_description":"電子通信エネルギー技術研究会（EE）, 2023年1月19日 - 20日, 九州工業大学","subitem_description_type":"Other"}]},"item_21_publisher_7":{"attribute_name":"出版社","attribute_value_mlt":[{"subitem_publisher":"電子情報通信学会","subitem_publisher_language":"ja"}]},"item_21_relation_38":{"attribute_name":"URI","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"https://ken.ieice.org/ken/paper/20230119WCQu/","subitem_relation_type_select":"URI"}}]},"item_21_rights_13":{"attribute_name":"著作権関連情報","attribute_value_mlt":[{"subitem_rights":"Copyright(C)2023 IEICE"}]},"item_21_select_59":{"attribute_name":"査読の有無","attribute_value_mlt":[{"subitem_select_item":"no"}]},"item_21_source_id_10":{"attribute_name":"NCID","attribute_value_mlt":[{"subitem_source_identifier":"AA11135980","subitem_source_identifier_type":"NCID"}]},"item_21_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2432-6380","subitem_source_identifier_type":"EISSN"},{"subitem_source_identifier":"0913-5685","subitem_source_identifier_type":"PISSN"}]},"item_21_subject_16":{"attribute_name":"日本十進分類法","attribute_value_mlt":[{"subitem_subject":"549","subitem_subject_scheme":"NDC"}]},"item_21_text_63":{"attribute_name":"連携ID","attribute_value_mlt":[{"subitem_text_value":"11108"}]},"item_21_version_type_58":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"古江, 文乃","creatorNameLang":"ja"},{"creatorName":"Furue, Ayano","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"宮坂, 晋永","creatorNameLang":"ja"},{"creatorName":"Miyasaka, Shinei","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"大串, 悠介","creatorNameLang":"ja"},{"creatorName":"Ogushi, Yusuke","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"山西, 理樹","creatorNameLang":"ja"},{"creatorName":"Yamanishi, Riki","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorAffiliations":[{"affiliationNames":[{}]}],"creatorNames":[{"creatorName":"Matsumoto, Satoshi","creatorNameLang":"en"},{"creatorName":"松本, 聡","creatorNameLang":"ja"},{"creatorName":"マツモト, サトシ","creatorNameLang":"ja-Kana"}],"familyNames":[{},{},{}],"givenNames":[{},{},{}],"nameIdentifiers":[{},{},{},{}]},{"creatorNames":[{"creatorName":"長谷川, 雅考","creatorNameLang":"ja"},{"creatorName":"Hasegawa, Masataka","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2023-03-28"}],"displaytype":"detail","filename":"nperc215.pdf","filesize":[{"value":"2.4 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"nperc215.pdf","url":"https://kyutech.repo.nii.ac.jp/record/7943/files/nperc215.pdf"},"version_id":"25de86f9-31a9-4e01-b622-463d44cfe27a"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"3次元パワーIC","subitem_subject_scheme":"Other"},{"subitem_subject":"バーチャルプロトタイピング","subitem_subject_scheme":"Other"},{"subitem_subject":"多層グラフェン","subitem_subject_scheme":"Other"},{"subitem_subject":"3D power IC","subitem_subject_scheme":"Other"},{"subitem_subject":"Virtual Prototyping","subitem_subject_scheme":"Other"},{"subitem_subject":"multilayer graphene","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"次世代スイッチング電源の設計方法としてのVirtual Prototypingの提案とこれを用いたスイッチング電源の小型化の検討","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"次世代スイッチング電源の設計方法としてのVirtual Prototypingの提案とこれを用いたスイッチング電源の小型化の検討","subitem_title_language":"ja"},{"subitem_title":"A Virtual Prototyping Technique as a Design Method of Next Generation Power Supply and Design Consideration of the Switching Power Supply for Miniaturization using the Proposed Technique","subitem_title_language":"en"}]},"item_type_id":"21","owner":"3","path":["24"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2023-03-28"},"publish_date":"2023-03-28","publish_status":"0","recid":"7943","relation_version_is_last":true,"title":["次世代スイッチング電源の設計方法としてのVirtual Prototypingの提案とこれを用いたスイッチング電源の小型化の検討"],"weko_creator_id":"3","weko_shared_id":-1},"updated":"2024-01-16T03:01:38.141439+00:00"}