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アイテム
Design Consideration of 3D Power SoC Using Virtual Prototyping
http://hdl.handle.net/10228/00009147
http://hdl.handle.net/10228/00009147f6a23416-59e0-4573-8689-d06519efe629
| 名前 / ファイル | ライセンス | アクション |
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nperc223.pdf (524.5 kB)
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| アイテムタイプ | 会議発表論文 = Conference Paper(1) | |||||||||||
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| 公開日 | 2023-03-29 | |||||||||||
| 資源タイプ | ||||||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_5794 | |||||||||||
| 資源タイプ | conference paper | |||||||||||
| タイトル | ||||||||||||
| タイトル | Design Consideration of 3D Power SoC Using Virtual Prototyping | |||||||||||
| 言語 | en | |||||||||||
| 言語 | ||||||||||||
| 言語 | eng | |||||||||||
| 著者 |
Furue, Ayano
× Furue, Ayano× Miyasaka, Sinei× Ogushi, Yusuke× Yamanishi, Riki× 松本, 聡
WEKO
27142
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| 抄録 | ||||||||||||
| 内容記述タイプ | Abstract | |||||||||||
| 内容記述 | 3D power supply on chip (3D power SoC), which integrates Si based IC, Gallium Nitride (GaN) power devices and passive devices realizes high efficiency at high frequency switching and high-power density. Miniaturization makes 3D power SoC high temperature, thus, we have to take into consideration of the temperature effect when we design 3D power SoC. In this paper, we propose a virtual prototyping technique, which is coupling of thermal-device, heat conduction, thermal-electromagnetic, and thermal-circuit simulation to design the 3D power supply on chip. | |||||||||||
| 備考 | ||||||||||||
| 内容記述タイプ | Other | |||||||||||
| 内容記述 | 2022 International Conference on Electronics Packaging (ICEP 2022), May 11 - 14, Sapporo (Hybrid) | |||||||||||
| 書誌情報 |
2022 International Conference on Electronics Packaging (ICEP) p. 155-156, 発行日 2022-06-17 |
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| 出版社 | ||||||||||||
| 出版社 | IEEE | |||||||||||
| DOI | ||||||||||||
| 関連タイプ | isVersionOf | |||||||||||
| 識別子タイプ | DOI | |||||||||||
| 関連識別子 | https://doi.org/10.23919/ICEP55381.2022.9795434 | |||||||||||
| ISBN | ||||||||||||
| 識別子タイプ | ISBN | |||||||||||
| 関連識別子 | 978-4-9911911-3-8 | |||||||||||
| ISBN | ||||||||||||
| 識別子タイプ | ISBN | |||||||||||
| 関連識別子 | 978-1-6654-8469-5 | |||||||||||
| 著作権関連情報 | ||||||||||||
| 権利情報 | Copyright (c) 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | 3D power SoC | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | Power Supply on Chip | |||||||||||
| キーワード | ||||||||||||
| 主題Scheme | Other | |||||||||||
| 主題 | Virtual Prototyping | |||||||||||
| 出版タイプ | ||||||||||||
| 出版タイプ | AM | |||||||||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||
| 査読の有無 | ||||||||||||
| 値 | yes | |||||||||||
| 連携ID | ||||||||||||
| 値 | 11116 | |||||||||||
