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Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints
http://hdl.handle.net/10228/5799
http://hdl.handle.net/10228/579945b2494e-e8be-405d-bacf-400c454a5aaa
| 名前 / ファイル | ライセンス | アクション |
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ICEPT2014_1229.pdf (332.8 kB)
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| Item type | 学術雑誌論文 = Journal Article(1) | |||||||||||||
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| 公開日 | 2016-09-23 | |||||||||||||
| 資源タイプ | ||||||||||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||||||||||
| 資源タイプ | journal article | |||||||||||||
| タイトル | ||||||||||||||
| タイトル | Effects of Resin Thickness on the Stress Intensity Factors of Edge-cracked Adhesive Joints | |||||||||||||
| 言語 | en | |||||||||||||
| 言語 | ||||||||||||||
| 言語 | eng | |||||||||||||
| 著者 |
Lan, Xin
× Lan, Xin× 野田, 尚昭
WEKO
3665
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| 抄録 | ||||||||||||||
| 内容記述タイプ | Abstract | |||||||||||||
| 内容記述 | The effects the thickness of epoxy resin on the stress intensity factors (SIFs) of the edge-cracked adhesive joints subjected to external loads are investigated in the current paper. The three-layered joints composed of Silicon, epoxy resin and FR-4.5 are widely seen in the package solutions of CSP/FBGA for electronic devices. Cracks or delaminations from resin-substrate interface or resin-silicon interface are the common failure modes in plastic IC packages. However, it is difficult to determine the exact stress state of a bi-material interface due to the oscillatory singularity. In this paper, the SIFs of the single edge-cracked joints are determined accurately by using the Crack Tip Stress Method. Then, the effects of resin thickness on the SIFs of various edge interface cracks under uniform tension are investigated by varying the resin thickness and crack length. It was found that the SIFs grow with the increment of resin thickness and reach constants when the resin thickness is larger than the width of the joint. | |||||||||||||
| 言語 | en | |||||||||||||
| 備考 | ||||||||||||||
| 内容記述タイプ | Other | |||||||||||||
| 内容記述 | 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), August 12-15, 2014, Chengdu, China | |||||||||||||
| 書誌情報 |
2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014) p. 1229-1234, 発行日 2014-08-12 |
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| 出版社 | ||||||||||||||
| 出版者 | IEEE | |||||||||||||
| DOI | ||||||||||||||
| 関連タイプ | isVersionOf | |||||||||||||
| 識別子タイプ | DOI | |||||||||||||
| 関連識別子 | https://doi.org/10.1109/ICEPT.2014.6922865 | |||||||||||||
| 著作権関連情報 | ||||||||||||||
| 権利情報 | Copyright (c) 2014 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. | |||||||||||||
| キーワード | ||||||||||||||
| 主題Scheme | Other | |||||||||||||
| 主題 | Stress intensity factors | |||||||||||||
| キーワード | ||||||||||||||
| 主題Scheme | Other | |||||||||||||
| 主題 | Stress singularity | |||||||||||||
| キーワード | ||||||||||||||
| 主題Scheme | Other | |||||||||||||
| 主題 | Adhesive joints | |||||||||||||
| キーワード | ||||||||||||||
| 主題Scheme | Other | |||||||||||||
| 主題 | Edge interface crack | |||||||||||||
| 出版タイプ | ||||||||||||||
| 出版タイプ | AM | |||||||||||||
| 出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||||||||||
| 査読の有無 | ||||||||||||||
| 値 | yes | |||||||||||||
| 研究者情報 | ||||||||||||||
| URL | https://hyokadb02.jimu.kyutech.ac.jp/html/10_ja.html | |||||||||||||
| 連携ID | ||||||||||||||
| 値 | 5609 | |||||||||||||
