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Vernier ring based pre-bond through silicon vias test in 3D ICs
http://hdl.handle.net/10228/00007524
http://hdl.handle.net/10228/000075248506c707-4180-44e6-aaae-022c4712063c
名前 / ファイル | ライセンス | アクション |
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elex.14.20170590.pdf (2.5 MB)
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Item type | 学術雑誌論文 = Journal Article(1) | |||||||||||
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公開日 | 2020-01-10 | |||||||||||
資源タイプ | ||||||||||||
資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||||||||
資源タイプ | journal article | |||||||||||
タイトル | ||||||||||||
言語 | en | |||||||||||
タイトル | Vernier ring based pre-bond through silicon vias test in 3D ICs | |||||||||||
その他のタイトル | ||||||||||||
その他のタイトル | Vernier Ring Based Pre-bond Through Silicon Vias Test in 3D ICs | |||||||||||
言語 | en | |||||||||||
言語 | ||||||||||||
言語 | eng | |||||||||||
著者 |
Ni, Tianming
× Ni, Tianming× Nie, Mu× Liang, Huaguo× Bian, Jingchang× Xu, Xiumin× Fang, Xiangsheng× Huang, Zhengfeng× 温, 暁青
WEKO
1143
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抄録 | ||||||||||||
内容記述タイプ | Abstract | |||||||||||
内容記述 | Defects in TSV will lead to variations in the propagation delay of the net connected to the faulty TSV. A non-invasive Vernier Ring based method for TSV pre-bond testing is proposed to detect resistive open and leakage faults. TSVs are used as capacitive loads of their driving gates, then time interval compared with the fault-free TSVs will be detected. The time interval can be detected with picosecond level resolution, and digitized into a digital code to compare with an expected value of fault-free. Experiments on fault detection are presented through HSPICE simulations using realistic models for a 45 nm CMOS technology. The results show the effectiveness in the detection of time interval 10 ps, resistive open defects 0.2 kΩ above and equivalent leakage resistance less than 18 MΩ. Compared with existing methods, detection precision, area overhead, and test time are effectively improved, furthermore, the fault degree can be digitalized into digital code. | |||||||||||
言語 | en | |||||||||||
書誌情報 |
IEICE Electronics Express 巻 14, 号 18, p. 20170590-1-20170590-11, 発行日 2017-09-25 |
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出版社 | ||||||||||||
出版者 | 電子情報通信学会 | |||||||||||
DOI | ||||||||||||
関連タイプ | isIdenticalTo | |||||||||||
識別子タイプ | DOI | |||||||||||
関連識別子 | https://doi.org/10.1587/elex.14.20170590 | |||||||||||
CRID | ||||||||||||
関連タイプ | isIdenticalTo | |||||||||||
識別子タイプ | URI | |||||||||||
関連識別子 | https://cir.nii.ac.jp/crid/1390001205220482944 | |||||||||||
日本十進分類法 | ||||||||||||
主題Scheme | NDC | |||||||||||
主題 | 549 | |||||||||||
ISSN | ||||||||||||
収録物識別子タイプ | EISSN | |||||||||||
収録物識別子 | 1349-2543 | |||||||||||
著作権関連情報 | ||||||||||||
権利情報 | Copyright (c) 2017 by The Institute of Electronics, Information and Communication Engineers | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | 3D IC | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | TSV | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | pre-bond | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | testing | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | time interval | |||||||||||
キーワード | ||||||||||||
主題Scheme | Other | |||||||||||
主題 | digital code | |||||||||||
出版タイプ | ||||||||||||
出版タイプ | VoR | |||||||||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||||||||
査読の有無 | ||||||||||||
値 | yes | |||||||||||
研究者情報 | ||||||||||||
https://hyokadb02.jimu.kyutech.ac.jp/html/300_ja.html | ||||||||||||
論文ID(連携) | ||||||||||||
10320902 | ||||||||||||
連携ID | ||||||||||||
8033 |